Semiconductor shipments are expected to exceed 1 trillion in 2021

Semiconductor shipments are expected to exceed 1 trillion in 2021. The total shipment of semiconductors this year is expected to exceed the 1 trillion mark. This includes transportation of ICs and optoelectronics, sensors/actuators and discrete (O-S-D) devices.

Semiconductor shipments are expected to exceed 1 trillion in 2021

The total shipment of semiconductors this year is expected to exceed the 1 trillion mark. This includes transportation of ICs and optoelectronics, sensors/actuators and discrete (O-S-D) devices.

According to a report, by 2021, semiconductor shipments will increase by 13%, reaching a record 1.135 trillion units. This is also the third time the semiconductor sector has broken through the trillion-dollar mark in a calendar year. In addition, the 13% growth achieved one year after the corona virus pandemic has had an adverse impact on the global economy and also has an impact on the industry’s shipments.

As early as 2004 to 2007, shipments exceeded the levels of 400, 500 and 600 billion units, just before the global financial crisis led to a sharp drop in shipments in 2008 and 2009. The rebound was strong, with shipments exceeding 700 billion units in 2010. Since then, there has been another strong growth in 2017, with an increase of 12% to 900 billion units.

The first shipment volume exceeded the trillion unit mark in 2018. It is worth noting that although the world is suffering from a severe semiconductor shortage, the news has arrived. This gave rise to various industries such as the automobile industry. On the other hand, the growth in shipments has witnessed the strongest growth in industries such as autonomous systems, cloud computing systems, and contactless systems.

Written by

Swasti Pujari

Associate Director, Backend Engineering at CoreIC Technologies, with 15+ years in VLSI Physical Design and backend engineering. Previously Practice Head at UST Global, leading Physical Design, STA, EMIR, DFT, and Physical Verification. Delivered 3nm, 6nm and 7nm projects for AMD, Intel, and Microchip, and published IEEE research on hybrid AI-EDA floorplanning.